Keywords: اتصال جوش; Environmental testing; Vibration; Fatigue; Probability distribution; Uncertainty; Thermal testing; Neural networks; Machine learning; Solder joint;
مقالات ISI اتصال جوش (ترجمه نشده)
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: اتصال جوش; PV manufacturing; Crystalline silicon solar cell; Solder joint; Thermo-mechanical damage; Fatigue life;
Keywords: اتصال جوش; Solder joint; Package-on-package; Thermal fatigue; Failure criterion; Simulation analysis;
Keywords: اتصال جوش; Sn3.8Ag0.7Cu (SAC); High cycle fatigue; Local stress; FKM guideline; Cyclic softening; Stress concentration; Roughness; Mean stress; Solder joint; Surface mount technology (SMT); Stress; Experimental analysis; Vibration;
Keywords: اتصال جوش; Solder joint; Void effect; IGBT module; Polydisperse distribution; Thermo-mechanical reliability; Finite element analysis;
Keywords: اتصال جوش; Solder joint; Creep; Fatigue; Life prediction
Keywords: اتصال جوش; Solder joint; Fatigue failure; Life prediction; High temperature;
Keywords: اتصال جوش; Solder joint; Cracking energy density; Mechanical fatigue test; Finite element method; Fatigue failure
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling
Keywords: اتصال جوش; Solder joint; Failure performance; Drop/vibration; Thermal/isothermal cycling;
Effect of stress triaxiality on damage evolution of porous solder joints in IGBT Discretes
Keywords: اتصال جوش; FEM simulation; Stress state; Triaxiality factor; Solder joint;
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes
Keywords: اتصال جوش; Ball impact test; Solder joint; Surface finish; Board-level drop test; Finite element analysis;
Evaluation of structural design methodologies for predicting mechanical reliability of solder joint of BGA and TSSOP under launch random vibration excitation
Keywords: اتصال جوش; Solder joint; Random vibration; Electronics; Mechanical reliability;
Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
Keywords: اتصال جوش; BGA; Solder joint; Fracture; Strain rate; CZM; Stiffness;
The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process
Keywords: اتصال جوش; Electrodeposition; Solder joint; Sn grain size; Microstructure; Cu6Sn5;
Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package
Keywords: اتصال جوش; Sn–3.0Ag–0.5Cu; wafer level chip scale package; solder joint; drop failure mode
Local shear stress-strain response of Sn-3.5Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis
Keywords: اتصال جوش; Solder joint; IMC; Lap-shear; Optical measurement of local displacements; Shear stress; Shear strain; Failure modes;
Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification
Keywords: اتصال جوش; BGA; Solder joint; Fracture; Strain rate; Mode ratio; Cohesive zone model; CZM; Strength; Mixed mode
Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP
Keywords: اتصال جوش; MCP; Packaging; Numerical analysis; Thermo-mechanical reliability; Solder junction structure; Solder joint
Numerical simulation and fatigue life estimation of BGA packages under random vibration loading
Keywords: اتصال جوش; Random vibration; Solder joint; Finite element simulation; Fatigue life
Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations
Keywords: اتصال جوش; Transient thermal analysis; Thermal resistance; Reliability; Solder joint; Light emitting diode LED
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module
Keywords: اتصال جوش; Damage; Fatigue; Solder joint; Power electronic module
Whisker growth in Sn and SnPb thin films under electromigration
Keywords: اتصال جوش; Whisker growth; Electromigration; Thin film; Solder joint
Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints
Keywords: اتصال جوش; Intermetallic compounds; Interfaces; Orientation; Solder joint; Cu single crystal; Electron Backscattering Diffraction (EBSD)
Solder joint inspection based on neural network combined with genetic algorithm
Keywords: اتصال جوش; Automatic optical inspection; Feature selection; Genetic algorithm; Neural network; Solder joint; Printed circuit board (PCB);
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints
Keywords: اتصال جوش; Solder joint; Interfaces; Intermetallic compounds; Fracture; Shear strength
Long-term stable encapsulated solder joints on an Al/Ni:V/Ag metallization for silicon solar cells
Keywords: اتصال جوش; crystalline silicon; solar cell; metallization; long-term stable; solder joint; laminate; evaporation; sputtering;
Non-destructive testing of Cu solder connections using active thermography
Keywords: اتصال جوش; Active thermography; Solder joint; Copper; FFT; Signal-to-noise-ratio
High temperature reliability of lead-free solder joints in a flip chip assembly
Keywords: اتصال جوش; Power electronics; High temperature electronics; Flip chip; Pb-free solder; Intermetallic compound; Microelectronics reliability; Fatigue failures; Solder joint
Enhanced solder joint bonding strength of electronic packaging with electrowetting effect
Keywords: اتصال جوش; Electrowetting-on-dielectric; Solder joint; Bonding strength; Electronic packaging; Silicon based system in package
Solderability study of RABiTS-based YBCO coated conductors
Keywords: اتصال جوش; Coated conductor; Solderability; Solder joint; Joint resistance;
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Keywords: اتصال جوش; X-FEM; Solder joint; Crack growth; Microstructure; Polycrystal fracture; Enrichment;
Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading
Keywords: اتصال جوش; Solder joint; Sn–Ag–Cu; Surface finish; Surfaces and interfaces; Mechanical properties; Intermetallics
Computational analysis of the interfacial effect on electromigration in flip chip solder joints
Keywords: اتصال جوش; Electromigration; Solder joint; The interface energy; Diffuse interface model
Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints
Keywords: اتصال جوش; Electromigration; SnPb; Solder joint; BGA; Intermetallic
A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture
Keywords: اتصال جوش; Proactive diagnostics; 1149.4 Analogue boundary scan; Thermal cycling; Reliability; Solder joint
Finite element analysis of lead-free surface mount devices
Keywords: اتصال جوش; 65.40.De; 85.40.Bh; Solder joint; Lead-free; Thermo-mechanical fatigue;
Structural improvement for solder joint failure in ultrasonic plastic assembly
Keywords: اتصال جوش; Ultrasonic plastic assembly; Structural improvement; Vibration analysis; Solder joint
Damage mechanics of electromigration induced failure
Keywords: اتصال جوش; Electromigration; Damage mechanics; Current crowding; Nanoelectronics; Solder joint; High current density
Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints
Keywords: اتصال جوش; Electromigration; Pb-free solder; Strength; Solder joint
Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies
Keywords: اتصال جوش; Fatigue; Flip chip; Solder joint; Lead free
High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints
Keywords: اتصال جوش; Joule heating; Heat dissipation; Electromigration; Solder joint; BGA
Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
Keywords: اتصال جوش; Trilayer; Layered beam; Laminated; Interfacial stress; Creep; Viscoelastic; Strain energy; Thermal cycling; Hysteresis; Ratcheting; Shakedown; Thermal stress; Thermal strain; Adhesive bond; Solder joint; Stress singularity
Mixed mode fracture toughness of lead-tin and tin-silver solder joints with nickel-plated substrate
Keywords: اتصال جوش; Solder joint; Fracture toughness; Mixed mode; Sn-37Pb; Sn-3.5Ag;
Growth and morphology of the intermetallic compounds formed at the Sn-9Zn-2.5Ag/Cu interface
Keywords: اتصال جوش; Interdiffusion coefficient; Solder joint; Intermetallic compound;
Fatigue crack growth behavior in Sn-Pb eutectic solder/copper joint under mode I loading
Keywords: اتصال جوش; Fatigue crack growth; Sn-Pb eutectic solder; Solder joint; Solder/copper interface; Adhesive strength;
Fatigue damage modeling in solder interconnects using a cohesive zone approach
Keywords: اتصال جوش; Cohesive zone; Fatigue damage; Solder joint; Life-time;
Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties
Keywords: اتصال جوش; Electromigration; Power electronics packaging; Nanoelectronics packaging; Solder joint; Viscoplasticity; Thermomigration;