کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
802967 | 1467543 | 2008 | 14 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Damage mechanics of electromigration induced failure
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Damage mechanics of electromigration induced failure Damage mechanics of electromigration induced failure](/preview/png/802967.png)
چکیده انگلیسی
Electromigration is a major road block in the pursuit of nanoelectronics and next generation power electronics. The current density in the state-of-the-art microelectronics solder joints is about 103 A/cm2. In the next generation nanoelectronics solder joints this current density is expected to increase by an order of magnitude, at least. In this paper, a new damage mechanics formulation is implemented in a general finite element procedure and used for simulation of solder joints electromigration induced failure. Nonlinear viscoplastic time-dependent nature of the material and current crowding effects are taken into account in the formulation. The model is verified against test data.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Mechanics of Materials - Volume 40, Issues 1–2, January–February 2008, Pages 66–79
Journal: Mechanics of Materials - Volume 40, Issues 1–2, January–February 2008, Pages 66–79
نویسندگان
Cemal Basaran, Minghui Lin,