کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1620607 | 1516391 | 2009 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
This study assesses the reliability of eutectic Sn–Pb, Sn–1.0Ag–0.5Cu, Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu solder bumps on three different pad surface finishes (ENIG, electrolytic Ni/Au and Cu-OSP) with and without an aging treatment at 150 °C for 100 h. This study focused primarily on how the pad surface finish and solder alloy composition affects the reliability of solder joints using a high-speed ball pull test method. The fracture forces and failure mechanisms were also examined. The results showed that the electrolytic Ni/Au surface finish had the highest fracture forces for all four different solder alloys with and without the aging process.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 486, Issues 1–2, 3 November 2009, Pages 242–245
Journal: Journal of Alloys and Compounds - Volume 486, Issues 1–2, 3 November 2009, Pages 242–245
نویسندگان
Taehoon You, Yunsung Kim, Woogwang Jung, Jeongtak Moon, Heeman Choe,