کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
543355 | 871653 | 2009 | 6 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Computational analysis of the interfacial effect on electromigration in flip chip solder joints Computational analysis of the interfacial effect on electromigration in flip chip solder joints](/preview/png/543355.png)
Recent experiments have shown failure in flip chip micro solder joints induced by electromigration. This paper proposes a three-dimensional computational model to simulate the evolution of micro and sub-micro scale solder joints due to electromigration induced diffusion. The evolving morphology of the solder joint related with multiple mechanisms causes a computational challenge. This is addressed by employing a diffuse interface model with multiple concentrations. To efficiently resolve complications, a semi-implicit Fourier spectral scheme and a biconjugate-gradient method are adopted. Results have demonstrated rich dynamics and solder breakage at the interface on the cathode side. Furthermore, the effect of the designed interface region on the reliability of solder joints has been investigated with the developed model.
Journal: Microelectronic Engineering - Volume 86, Issue 10, October 2009, Pages 2132–2137