Characterization and properties of epoxy resin (E-20) modified with silicone intermediate RSN-6018

In this research, a series of epoxy resin modified with organosilicone intermediate RSN-6018 (RE) were prepared through a condensation reaction between the COH of bisphenol-A type epoxy resin and the SiOH of organosilicon intermediate. These resins, having solid content up to 80 wt.%, could be cured at room temperature by a polyamide curing agent to yield transparent coatings. Chemical structures of the products were characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). The morphology of fractured surfaces of the cured coating films was studied by scanning electron microscopy (SEM). The thermal properties of the cured coatings were evaluated by thermogravimetric analysis (TGA). The results indicated that film was stable while temperature below 348.96 °C, and the film hardness could be up to 6H when the content of organosilicon was 44.2%. Differential scanning calorimetry (DSC) analysis tests displayed that the glass transition temperature (Tg) of cured coatings decreased when the ratio of organosilicon intermediate increased.