Thermal conductivity and lap shear strength of GNP/epoxy nanocomposites adhesives

The addition of graphene nanoplatelets (GNPs) into the epoxy adhesives has been studied in order to increase their thermal conductivity. Thermally conductive adhesives are often used as thermal interface materials (TIMs). The incorporation of 8 and 10 wt% GNPs reinforcement caused a thermal conductivity enhancement of ~206 and ~306%, respectively. The wettability seems to decrease with low GNPs content (2-3 wt%) in comparison with the neat epoxy adhesive but the contact angle remains constant for higher GNPs contents. Lap shear strength remains constant for neat adhesives and resins doped with GNPs. The lack of enhancement of adhesive properties of doped resins is due to a weak interface reinforcement-matrix. In fact, the joint failure is in the adhesive except for high GNPs content (10 wt%) where a cohesive failure mode is observed.