کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7220710 | 1470330 | 2015 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructure, interfacial IMC and mechanical properties of Sn-0.7Cu-xAl (x = 0-0.075) lead-free solder alloy
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی (عمومی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The effect of aluminum concentration on the microstructure, wettability, interfacial IMC and mechanical properties of Sn-0.7Cu lead-free solder alloy is investigated. The results show that the microstructure of Sn-Cu-Al solder alloy consists of β-Sn, eutectic and IMC, and the microstructure of Sn-0.7Cu alloy is refined by adding aluminum. The interfacial IMC at the boundary of β-Sn in the Sn-0.7Cu-(0.01-0.025)Al is Cu6Sn5, and it is varied to Al2Cu in the Sn-0.7Cu-(0.05-0.075)Al. The wettability of Sn-Cu-Al solder alloy is improved by aluminum, the spreading coefficient of Sn-0.7Cu-0.075Al reaches about 70%. The thickness of the scalloped interfacial IMC is dominated by the IMC variation, and the chemical reaction between Cu and segregated Al. The mechanical properties of Sn-Cu-Al solder alloy are decreased slightly by adding aluminum. The tensile strength and the creep resistance of Sn-0.7Cu-(0.05-0.075)Al are superior to Sn-0.7Cu-(0.01-0.025)Al due to the hindering dislocation slipping by the disperse Al2Cu. Sn-0.7Cu-(0.05-0.075)Al is an applicable lead-free solder alloy for the Cu substrate.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials & Design - Volume 67, 15 February 2015, Pages 209-216
Journal: Materials & Design - Volume 67, 15 February 2015, Pages 209-216
نویسندگان
Li Yang, Yaocheng Zhang, Jun Dai, Yanfeng Jing, Jinguo Ge, Ning Zhang,