Flip-chip packaging of piezoresistive pressure sensors

A packaging technology for piezoresistive silicon pressure sensors is presented which is based on the use of standard flip-chip bonding of the sensor die on a printed circuit board. The assessment of the packaging proposal has been carried out by using low-range, high-sensitivity relative pressure sensors. The characterization of the fabricated devices has shown the feasibility of the proposal in terms of stability and sensitivity although a higher dependence of the sensitivity on temperature than in the case of standard packaging. Since this drawback can readily be compensated for by the signal conditioning circuitry, the proposed packaging scheme can be of interest for cost-limited applications.