Keywords: فلیپ چیپ; Dipping process; Flip-chip; Multiparameter; Microelectronics packaging; Flux;
مقالات ISI فلیپ چیپ (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: فلیپ چیپ; Light emitting diodes; Eutectic bond; Flip-chip; Thermal resistance
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
Keywords: فلیپ چیپ; Capillary underfill; Encapsulation technology; Flip-chip; Solder bump shape; Particle image velocimetry (PIV);
High reliable and chromaticity-tunable flip-chip w-LEDs with Ce:YAG glass-ceramics phosphor for long-lifetime automotive headlights applications
Keywords: فلیپ چیپ; Ce:YAG glass-ceramic; White-LED; Rapid-solidification; Quenching; Flip-chip; Photoluminescence;
Improving the performance of power GaN-based thin-film flip-chip LEDs through a twofold roughened surface
Keywords: فلیپ چیپ; GaN; Light-emitting diode; KrF excimer laser; Laser irradiation; Chemical wet etching; Thin-film; Flip-chip
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
Keywords: فلیپ چیپ; Electromigration; Flip-chip; Laminography; Synchrotron radiation; Finite-element modeling;
Formation of octahedral corrosion products in Sn-Ag flip chip solder bump
Keywords: فلیپ چیپ; Flip-chip; Solder; Corrosion; TEM;
Cluster based dynamic area-array I/O planning for flip chip technology
Keywords: فلیپ چیپ; Flip-chip; Chip and package co-design
The effective permeability of the underfill flow domain in flip-chip packaging
Keywords: فلیپ چیپ; Underfill; Flip-chip; Capillary flow; Power-law fluid
Demonstration of silver micro-joints for flip-chip interconnect
Keywords: فلیپ چیپ; Silver; Silver joints; Flip-chip; Interconnect; Solid-state bonding; Electronic packaging;
A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications
Keywords: فلیپ چیپ; InxGa1-xAs-channel; HEMTs; Flip-chip; High frequency package
Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader
Keywords: فلیپ چیپ; Thermal analysis; Vapor chamber; Flip-chip; Thermal interface material
Electrical and optical characterization of GaN-based light-emitting diodes fabricated with top-emission and flip-chip structures
Keywords: فلیپ چیپ; GaN; Light emitting diode; Flip-chip; Top-emission; Forward voltage; Light extraction
Al contacts to nanoroughened p-GaN
Keywords: فلیپ چیپ; Nanoroughening; Flip-chip; Al contact; Contact resistivity; Schottky barrier height
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
Keywords: فلیپ چیپ; Linear visco-elastic; Solder paste; Isotropic conductive adhesives; Flip-chip; Rheology; Lead-free
Low-k compatible all-copper flip-chip connections
Keywords: فلیپ چیپ; Flip-chip; Interconnects; Electroless copper; Thermo-mechanical reliability; Stress modeling
Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Keywords: فلیپ چیپ; Flip-chip; AuSn; Soldering; Intermetallic compounds; Wetting
Optimization of board-level thermomechanical reliability of high performance flip-chip package assembly
Keywords: فلیپ چیپ; Board-level reliability; Thermal cycling; Flip-chip; Optimization; Taguchi optimization method; L18 orthogonal array
Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions
Keywords: فلیپ چیپ; Packaging; Flip-chip; Electroplating; Solder
Flip-chip packaging of piezoresistive pressure sensors
Keywords: فلیپ چیپ; Pressure sensor; Flip-chip; Packaging; Piezoresistive
Laser soldering of flip-chips
Keywords: فلیپ چیپ; Laser; Flip-chip; Soldering; Finite element modeling; Gravure offset printing
Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects
Keywords: فلیپ چیپ; Lead-free; Flip-chip; Thermal ageing; Intermetallics; Nano-indentation;