Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 117, 15 September 2016, Pages 100-110

Yuan-Wei Chang, Yin Cheng, Feng Xu, Lukas Helfen, Tian Tian, Marco Di Michiel, Chih Chen, King-Ning Tu, Tilo Baumbach,