کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
777710 | 1463781 | 2013 | 9 صفحه PDF | دانلود رایگان |
Prior work by the authors has proposed a dissipated energy theory of fatigue crack growth in ductile solids under mode I loading based on the total plastic dissipation per cycle ahead of the crack. The approach has since been extended to a general bimaterial interface geometry under mixed-mode I/II loading, with application to fatigue debonding of layered materials. An inherent assumption of this prior work is that a perfect crack exists along the interface between the two materials. The current work extends the approach to incorporate a grading of material properties between the two layers, as may occur in a variety of welding, soldering or layered manufacturing applications. Attention is restricted to elastic perfectly-plastic layers with identical elastic properties and a mismatch in yield strength across a linearly graded interface, with the crack on the boundary of the weaker material. A dimensionless plastic dissipation is extracted from 2-D plane strain finite element models over the full range of yield strength mismatches, graded layer thicknesses and mixed-mode loading conditions. Results reveal that for all modes of loading, the effect of a graded layer is to increase the total plastic dissipation per cycle, which is bounded by the extremes in plastic mismatch for a perfect crack interface. While the graded layer has a measurable effect, the plastic dissipation for all strength mismatches is dominated by the mode of loading.
► This paper builds on the authors’ prior work for a perfect crack interface.
► A graded layer represents a more realistic model for many ductile interfaces.
► Results indicate that a graded layer acts to increase the plastic dissipation.
► Effect is bounded by extremes in plastic mismatch for a perfect crack interface.
► Results may help contribute to the design of fatigue-resistant interfaces.
Journal: International Journal of Fatigue - Volume 51, June 2013, Pages 96–104