Debonding failure characteristics of multi-laminated bonding system under cryogenic temperature

In the present paper, the debonding failure characteristics of epoxy and polyurethane adhesives embedded using a multi-laminated bonding system (MLBS) under cryogenic temperatures are evaluated. A series of pull-off and lap-shear tests under various temperatures (293, 163, and 110 K) are performed to identify the debonding failure characteristics of the MLBS. A modification of the Ramberg–Osgood constitutive model is carried out to predict the temperature-dependant elastic–inelastic stress–strain behaviour of the MLBS. The temperature-dependant material parameters are predicted using an empirical formulation. The debonding failure phenomenon is also studied.