Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

• The 80Au/20Sn solder has a high degree of organizational stability.
• Using Coffin-Manson and Morrow models to predict the low cycle fatigue behavior.
• The 80Au/20Sn solder has enhanced fatigue resistance compared to 63Sn/37Pb solder.

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.