کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
781005 | 1463789 | 2012 | 7 صفحه PDF | دانلود رایگان |

This paper describes a creep–fatigue life of Sn–8Zn–3Bi solder under multiaxial loading. A push–pull and a reversed torsion tests were carried out using seven types of strain waveforms, which are a fast–fast, a fast–slow, a slow–fast and a slow–slow waveforms and three types trapezoidal strain waveforms with different strain holding times. The strain waveforms had a significant effect on creep–fatigue life and the shortest creep–fatigue life was found in the slow–fast strain waveform while the longest life in the slow–slow waveform in the push–pull and the reversed torsion tests. Creep–fatigue life in the reversed torsion test was approximately twice longer than that in the push–pull test at each strain waveform. Applicability of common used creep–fatigue damage models for life evaluation was discussed based on the obtained experimental results and only a grain boundary sliding model could evaluate the lives within a small scatter.
► Multiaxial creep–fatigue tests were conducted for Sn–8Zn–3Bi solder.
► Unsymmetrical triangular waveforms give significant reductions in the life.
► Large reduction in the life was found in fast–slow and slow–fast waveforms.
► No reduction in the life can be seen in a slow–slow strain waveform.
► A grain boundary sliding model evaluates the multiaxial creep–fatigue lives.
Journal: International Journal of Fatigue - Volume 43, October 2012, Pages 235–241