کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7888704 | 1509796 | 2018 | 24 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Geometrical morphology optimisation of laser drilling in B4C ceramic: From plate to hollow microsphere
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Geometrical morphology optimisation of laser drilling in B4C ceramic: From plate to hollow microsphere Geometrical morphology optimisation of laser drilling in B4C ceramic: From plate to hollow microsphere](/preview/png/7888704.png)
چکیده انگلیسی
Boron carbide (B4C) ceramic plates with 400-µm thickness and hollow microspheres were used for hole machining study with a fibre laser. The diameter, hole circularity, taper angle, and recast layer were evaluated as functions of processing parameters such as the peak power and the ablation time. Scanning electron microscope (SEM) was used to observe surface morphologies of drilled materials and the attached energy-dispersive spectrometer was used for elemental analyses of recast layers around holes. Based on the results of characterisations, holes on front side were found to have a larger diameter but a worse circularity than those on back side under different conditions. The taper angle was steady near 1.8° with the increase in laser parameter values. To obtain holes on B4C ceramic with relatively good quality, the peak power and the ablation time should be controlled to be about 40 W and in 5-10 ms. In addition, compared with previous reports, superior holes drilled on B4C hollow microspheres with a better circularity and smooth layer on the inner wall can be obtained.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ceramics International - Volume 44, Issue 2, 1 February 2018, Pages 1370-1375
Journal: Ceramics International - Volume 44, Issue 2, 1 February 2018, Pages 1370-1375
نویسندگان
Lin Su, Ruichong Chen, Zhangyi Huang, Mao Zhou, Qiang Zeng, Qiwu Shi, Zhijun Liao, Tiecheng Lu,