Adherend thickness influence on fatigue behavior and fatigue failure prediction of adhesively bonded joints

The effect of the adherend thickness, h, on mode-I fatigue behavior of a toughened epoxy adhesive system was examined in terms of the substrate global stiffness and curing residual stress. It was found that a change in adherend thickness from 1.6 mm to 12.7 mm caused a reduction in the fatigue performance; i.e. the threshold energy release rate decreased and the crack growth rate increased for a given applied energy release rate. Finite element modeling showed that the fatigue results could be explained in terms of an increase in the crack tip stresses and an enlarged plastic zone due to the greater global stiffness of thicker joints. No difference in fatigue behavior was observed for mixed-mode loading at relatively small phase angles; however, it is expected that at higher phase angles the adverse effect of h would be observed.