کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7952116 | 1513708 | 2018 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Direct joining of oxygen-free copper and carbon-fiber-reinforced plastic by friction lap joining
ترجمه فارسی عنوان
پیوند مستقیم از پلاستیک تقویت شده مس و کربن بدون اکسیژن با پیوند لبه اصطکاک
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کلمات کلیدی
پیوند اصطکاک فلز، پلاستیک ترموپلاستیک تقویت شده با فیبر کربن، مواد مختلف متصل به،
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
شیمی مواد
چکیده انگلیسی
Oxygen-free copper (Cu) was successfully joined to carbon-fiber-reinforced thermoplastic (CFRTP, polyamide 6 with 20Â wt% carbon fiber addition) by friction lap joining (FLJ) at joining speeds of 200-1600Â mm/min with a constant rotation rate of 1500Â rpm and a nominal plunge depth of 0.9Â mm. It is the first time to report the joining of CFRTP to Cu by FLJ. As the joining speed increased, the tensile shear force (TSF) of joints increased first, and decreased thereafter. The maximum TSF could reach 2.3Â kN (15Â mm in width). Hydrogen bonding formed between the amide group of CFRTP and the thin Cu2O layer on the Cu surface, which mainly contributed to the joint bonding. The influence factors of the TSF of the joints at different joining speeds were discussed. The TSF was mainly affected by the joining area, the degradation of the plastic matrix and the number and the size of bubbles. As the joining speed increased, the influence factors varied as follows: the joining area increased first and then decreased; the degradation of the plastic matrix and the number and the size of bubbles decreased. The maximum TSF was the comprehensive result of the relatively large joining area, small degradation of the plastic matrix and small number and sizes of bubbles.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Materials Science & Technology - Volume 34, Issue 1, January 2018, Pages 192-197
Journal: Journal of Materials Science & Technology - Volume 34, Issue 1, January 2018, Pages 192-197
نویسندگان
L.H. Wu, K. Nagatsuka, K. Nakata,