کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7972483 1514619 2018 13 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging
ترجمه فارسی عنوان
پیوند ریز فاز مایع فیزیکی از طریق اثر مویرگی برای بسته بندی دستگاه های قدرت با درجه حرارت بالا
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد دانش مواد (عمومی)
چکیده انگلیسی
A novel transient liquid phase (TLP) bonding was achieved by using a hybrid solder preform containing porous Cu interlayer, which was prepared by compacting a thin layer of Cu powders with Sn foils. This method combines the advantages of the conventional TLP bonding and sintering, and it can accelerate the reaction rate, suppress the voids formation, and be performed with lower pressure. During bonding process, liquid Sn on the two interfaces flows rapidly into the gaps between neighbored Cu particles through a strong capillary action, resulting in the densification of the microstructure. The TLP process can be accomplished at a temperature of 250 °C within 20 min, sequentially producing a high heat-resistant joint, which is comprised primarily of Cu-Sn intermetallic compounds (IMCs) matrix and dispersive Cu particles. In this study, the microstructure evolution, mechanical property, thermal reliability, and the effects of Cu particle size and morphology on the bonding process were investigated systematically.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 724, 2 May 2018, Pages 231-238
نویسندگان
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