Improved creep resistance of Al-Cu alloy matrix composite reinforced with bimodal-sized TiCp

The creep resistance of the bimodal-sized (micron+nano) TiCp/Al-Cu composite was 10-38 times and 3-6 times higher than that of the Al-Cu matrix alloy and monomodal-sized composites, respectively, attributed to strengthening effects of nano-TiCp and larger number of finer θ′ precipitates.