Diffusion bonding of SU 263

Using a specially constructed apparatus, diffusion bonding of SU 263 alloy was studied in the temperature range of 1123–1323 K and compressive stress of 90% of its yield strength at the corresponding temperatures to determine the relative importance of the process parameters, the mechanism(s) responsible for bonding and the joint characteristics. Bond quality was assessed by optical metallography and lap shear testing. The mechanism of bonding was evaluated by grain growth equation. The experimental results were compared with a model developed by Pilling [Pilling, J., 1988. The kinetics of isostatic diffusion bonding in superplastic materials. Mater. Sci. Eng. 100, 137–144] in which the void closure by creep flow and diffusion are considered. Quantified EPMA line scan analysis was carried out to confirm the bonding mechanism and to determine the composition at the interface.