کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8012098 | 1516937 | 2017 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructural characteristics of the solder/Cu joint after an isothermal aging at 150 °C was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound (IMC) layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Transactions of Nonferrous Metals Society of China - Volume 27, Issue 1, January 2017, Pages 234-240
Journal: Transactions of Nonferrous Metals Society of China - Volume 27, Issue 1, January 2017, Pages 234-240
نویسندگان
Guo-ji ZHAO, Guang-hua WEN, Guang-min SHENG,