Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Poly (ether ether ketone)/multiwalled carbon nanotubes composites were metallized by electroless copper plating. The process was based on NaBH4 reducing the Cu2+ ions in electroless plating bath to Cu0 species on the wall of micropores of the swelled composites and simultaneously the Cu0 acted as catalyst initiating the autocatalytic deposition of copper. A dense copper coating was formed. The sheet resistance decreased with increasing the electroless plating time. The adhesion of the copper coating reached the highest 5 B scale according to ASTM D3359. And the electroless process avoided using noble metal Pd as catalyst.