کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8022211 | 1517282 | 2013 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Sn-3.5Ag solder reacted with heat-treated Cu films, and the characteristics of Kirkendall void formation at the Cu3Sn/Cu interface were investigated. Heat-treatment for the suppression of Kirkendall void formation in Sn-3.5Ag/Cu solder joints was conducted at varying temperature (T=400, 500 and 600 °C). The results showed that S segregation on the void surfaces were effectively suppressed by heat-treatment, and Kirkendall voiding at the Cu3Sn/Cu interface decreased as the heat-treatment temperature was increased. According to the solid solubility limit of sulfur in Cu, S in Cu film was in solid solution at all heat-treatment temperatures, so the amount of sulfur segregation was reduced.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 106, 1 September 2013, Pages 75-78
Journal: Materials Letters - Volume 106, 1 September 2013, Pages 75-78
نویسندگان
S.H. Kim, Jin Yu,