کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8023300 | 1517533 | 2018 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A novel CoCuP electrodeposited film with improved planar hard magnetic properties and film quality
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
We designed to add Cu into Co-P hard magnetic films prepared via electroplating. The purpose was to make use of immiscibility between Co and Cu, hoping that Cu will segregate at Co-grain-boundaries to mediate magnetic decoupling. Copper is found very difficult to co-electrodeposit with Co due to the large difference in the reduction potentials. A slight variation of CuSO4 concentration in the electrolyte from 1â¯mM to 2â¯mM results in a big difference of Cu content from 3.8â¯wt% to 13â¯wt% in CoCuP films. However, the CoCuP films are amazingly crack-free up to a thickness no less than 6â¯Î¼m. The films electroplated with CuSO4 concentration 1.3â¯mM at pHâ¯4.7 and 25â¯Â°C have a Cu content 5.5â¯wt%, P content 3.1â¯wt% and exhibit the best magnetic properties. The in-plane magnetic properties are Hc 360 Oe, Br 7450 G, and (BH)m 1.21 MGOe. The perpendicular ones are Hc 800 Oe, Br 1600 G, and (BH)m 0.35 MGOe. The evolution in film composition, microstructure and crystal structure well explains the variation in resultant magnetic properties. These films are readily applicable in mini- and micro-devices which need in-plane magnetic performance.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 350, 25 September 2018, Pages 890-895
Journal: Surface and Coatings Technology - Volume 350, 25 September 2018, Pages 890-895
نویسندگان
Chao-Yu Huang, Chi-Ju Hsiao, Chiao-Chi Lin, Chao-Sung Lin, Jen-Yuan (James) Chang, Cheng-Kuo Sung, Sheng-Ching Wang, Tsung-Shune Chin,