کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8025410 | 1517584 | 2016 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of deposition method on the microstructure and intermetallic compound formation in Ag-Sn bilayers
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effects of deposition method on the microstructure and intermetallic compound formation in Ag-Sn bilayers Effects of deposition method on the microstructure and intermetallic compound formation in Ag-Sn bilayers](/preview/png/8025410.png)
چکیده انگلیسی
Thermal evaporation and magnetron sputtering were used for the deposition of bilayers of Ag and Sn with different stacking sequences of the sublayers, Ag on Sn (Ag/Sn) or Sn on Ag (Sn/Ag). The deposition method used significantly affects the intermetallic compound (IMC) formation in these thin films already during film deposition. Comparison of the corresponding microstructures and textures indicates that the observed, striking differences in IMC formation for the case of Ag/Sn bilayers can be related to the interplay of Sn upward diffusion, surface energy and interfacial intermixing for the two deposition methods.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 295, 15 June 2016, Pages 88-92
Journal: Surface and Coatings Technology - Volume 295, 15 June 2016, Pages 88-92
نویسندگان
P. Rossi, N. Zotov, E.J. Mittemeijer,