Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates

NiCr (80/20 at.%) alloy thin film was deposited on the copper foil, glass and silicon substrates by DC magnetron sputtering method, respectively. The structure, stress and resistivity of NiCr thin films were affected by the different substrates. The preferred orientations of NiCr thin film were Ni (011) and Cr (011) on the copper foil substrate with rough surface, while only Ni (111) on the glass and silicon substrates. And the internal stress of NiCr thin film was tensile stress on the copper foil, while compressive stress on the glass and silicon substrates. These differences then resulted in larger resistivity of NiCr thin film deposited on copper foil than glass or silicon substrate. However, the temperature coefficient of resistance (TCR) of NiCr thin film was slightly influenced by the different substrates.