Nondestructive determination of interfacial adhesion property of low-k/Si by the surface acoustic waves

► The surface acoustic wave method is promoted to study the film adhesion property. ► The spring boundary model is used in SAW to inspect the interfacial property. ► Two low-k samples are tested to verify the feasibility of the proposed method. ► The adhesion qualities resulted from the promoted SAW and scratch have same trend. ► This method is accurate, quantitative and nondestructive for the adhesion test.