Thermoelectric self-cooling for power electronics: Increasing the cooling power

Simulation tests have indicated that simple system modifications allow relevant improvements in the cooling power. Replacement of a thermoelectric module with a thermal bridge leads to 33.54 kW/m2 of top cooling power. Likewise, thermoelectric modules with shorter legs and higher number of pairs lead to a top cooling power of 44.17 kW/m2. These results demonstrate the applicability of thermoelectric self-cooling to power electronics.