کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8077581 | 1521476 | 2014 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Analysis of pressure fluctuations to evaluate thermal performance of oscillating heat pipe
ترجمه فارسی عنوان
تجزیه و تحلیل نوسانات فشار برای ارزیابی عملکرد حرارتی لوله نوسان گرما
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی انرژی
انرژی (عمومی)
چکیده انگلیسی
The oscillations of liquid slugs and vapor plugs inside an oscillating heat pipe (OHP) are captured and shown in terms of pressure frequency spectrum. Pressure fluctuation inside a single loop OHP between the evaporative and the condensing sections is analyzed to evaluate thermal performance. De-Ionized (DI) water and Cu/water nanofluid with different mass fractions (0.5Â wt%, 1Â wt%, 2Â wt% and 3Â wt%) are studied subjected to the evaporative heat load of 20-120Â W. Swirling, bubble creation and bubble growth phenomena are observed inside OHP integrated with circulation and oscillating motion of vapor plug and liquid slug. Furthermore, deposition of nanoparticles is found on the surface of the evaporative section of OHP when charged with nanofluid. Experimental results show that Cu/Water nanofluid containing 2Â wt% of Cu nanoparticles facilitates lowest thermal resistance and highest magnitude of pressure fluctuation inside OHP. Maximum 22% efficiency is achieved by Cu/Water nanofluid with 2Â wt% of Cu nanoparticles at 80Â WÂ of evaporative power input. However, thermal performance is found significantly interrelated with inside pressure fluctuation of OHP. Cu/water nanofluid is found to promote circulation and oscillation of the liquid slug and the vapor plug rather than reinforcing bubble formation and bubble growth inside OHP.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Energy - Volume 70, 1 June 2014, Pages 135-142
Journal: Energy - Volume 70, 1 June 2014, Pages 135-142
نویسندگان
Md J. Nine, Md. Riyad Tanshen, B. Munkhbayar, Hanshik Chung, Hyomin Jeong,