3D integration of Geiger-mode avalanche photodiodes aimed to very high fill-factor pixels for future linear colliders

This paper presents an analysis of the maximum achievable fill-factor by a pixel detector of Geiger-mode avalanche photodiodes with the Chartered 130 nm/Tezzaron 3D process. The analysis shows that fill-factors between 66% and 96% can be obtained with different array architectures and a time-gated readout circuit of minimum area. The maximum fill-factor is achieved when the two-layer vertical stack is used to overlap the non-sensitive areas of one layer with the sensitive areas of the other one. Moreover, different sensor areas are used to further increase the fill-factor. A chip containing a pixel detector of the Geiger-mode avalanche photodiodes and aimed to future linear colliders has been designed with the Chartered 130 nm/Tezzaron 3D process to increase the fill-factor.