کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8918675 | 1642856 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی انرژی
مهندسی انرژی و فناوری های برق
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection](/preview/png/8918675.png)
چکیده انگلیسی
The paper aims to investigate numerically the mixed convection heat transfer characteristics from seven non-identical IC chips (Aluminium) mounted on a Switch Mode Power Supply (SMPS) board (substrate) made by FR-4 (glass-reinforced epoxy laminate material). The objective is to determine the optimum configuration of these IC chips positioned at different locations on the substrate board. The optimum configuration is proposed by defining a non-dimensional geometric distance parameter (λ) and by employing a hybrid strategy (collaborating Artificial neural network (ANN) and Genetic algorithm (GA)). 3D, steady state numerical simulations are carried out using ANSYS Icepak to determine the temperature distribution of the IC chips. It has been confirmed that, the temperature of the IC chips strongly rely on their shape, size, and location on the substrate board. The hybrid optimization is the most robust technique to predict the arrangement of the IC chips on the substrate board more accurately, as compared to conventional methods.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Thermal Science and Engineering Progress - Volume 7, September 2018, Pages 221-229
Journal: Thermal Science and Engineering Progress - Volume 7, September 2018, Pages 221-229
نویسندگان
V.K. Mathew, Tapano Kumar Hotta,