کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8955673 | 1646098 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Experimental and numerical study for Cu metal coatings at room temperature via powder spray process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The effect of Cu particle size on deposition behavior of Cu coating layer was investigated by experimental and numerical studies to understand coating behavior of metal films during aerosol deposition (AD) process. Experimental results showed that Cu film fabricated using 2â¯Î¼m Cu powder had high deposition rate, low resistivity, and high internal micro-strain. Moreover, Cu films fabricated using 2â¯Î¼m Cu powder had dense microstructure and Cu oxide phases due to elevated temperature caused by kinetic energy of impacted particles. However, Cu films prepared with 5â¯Î¼m Cu powder formed filmy deposition layers with poor structural and electrical properties. Numerical results revealed that the generated strain and heat at the impact interface between the particle and the substrate were significantly decreased with increasing particle size. In contrast, the maximum shock pressure of particles was increased with increasing particle size. These results demonstrate that metal Cu particle with size of about 2â¯Î¼m is suitable for forming good quality coating layers and that their bonding is associated with high compressive strain and thermal energy.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 353, 15 November 2018, Pages 66-74
Journal: Surface and Coatings Technology - Volume 353, 15 November 2018, Pages 66-74
نویسندگان
Dong-Won Lee, Myung-Yeon Cho, Ik-Soo Kim, Yong-Nam Kim, Daeseok Lee, Sang-Mo Koo, Chulhwan Park, Jong-Min Oh,