کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9567260 | 1503711 | 2005 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Pulsed laser deposition of metallic films on the surface of diamond particles for diamond saw blades
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
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چکیده انگلیسی
Ti or Ni films have been deposited on the diamond particle surfaces by pulsed laser deposition. Compressive resistance of the uncoated and coated diamond particles was measured, respectively, in the experiments. The compressive resistance of the Ti-coated diamonds particles was found much higher than that of the uncoated ones. It increased by 39%. The surface morphology is observed by the metallography microscope. The surface of the uncoated diamonds particles had many hollows and flaws, while the surface of Ni-coated diamond particles was flat and smooth, and the surface of Ti-coated diamond particles had some metal masses that stood out of the surface of the Ti-coated film. The components of the metallic films of diamond particles were examined by X-ray diffractometry (XRD). TiC was found formed on the Ti-coated diamond surface, which resulted in increased surface bonding strength between the diamond particles and the Ti films. Meanwhile, TiC also favored improving the bonding strength between the coated diamond particles and the binding materials. Moreover, the bending resistance of the diamond saw blade made of Ti-coated diamond was drastically higher than that of other diamond saw blades, which also played an important role in improving the blade's cutting ability and lifetime. Therefore, it was most appropriate that the diamond saw blade was made of Ti-coated diamond particles rather than other materials.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 246, Issues 1â3, 15 June 2005, Pages 207-213
Journal: Applied Surface Science - Volume 246, Issues 1â3, 15 June 2005, Pages 207-213
نویسندگان
Jiang Chao, Luo Fei, Long Hua, Hu Shao-liu, Li Bo, Wang You-qing,