کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9567495 | 1503717 | 2005 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Selective electroless deposition of copper on polyimide surface by microcontact printing
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Polyimide can hardly be patterned by microcontact printing method due to its poor adhesive property. This paper reports the electroless deposition of copper pattern on a siloxane-containing polyimide by microcontact printing. The incorporation of siloxane components into polyimide changes the surface properties of polyimide and enables it to be directly patterned by elastic stamp transferred organic silane. Selectively copper deposition is achieved through the silane patterns, which define the catalysts bound area. The siloxane-containing polyimide is demonstrated to be a suitable substrate for microcontact printing which does not need to be chemically modified prior to stamping. The simplicity of this process for creating selective copper patterns on polyimide material is highlighted.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 241, Issues 3â4, 15 March 2005, Pages 471-476
Journal: Applied Surface Science - Volume 241, Issues 3â4, 15 March 2005, Pages 471-476
نویسندگان
Yi Li, Dongsheng Chen, Qinghua Lu, Xuefeng Qian, Zikang Zhu, Jie Yin,