Different Failure signatures of multiple TLP and HBM Stresses in an ESD robust protection structure

The failure signatures of a grounded-base NPN bipolar ESD protection under multiple TLP and HBM stresses are analyzed. For this particular device having a graded collector region, multiple TLP or HBM stresses result in different types of defects. OBIC techniques and TCAD simulations are used to thoroughly analyze the involved physical mechanisms.