کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9674296 | 1453203 | 2005 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
بهداشت و امنیت شیمی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant](/preview/png/9674296.png)
چکیده انگلیسی
The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Hazardous Materials - Volume 120, Issues 1â3, 11 April 2005, Pages 15-20
Journal: Journal of Hazardous Materials - Volume 120, Issues 1â3, 11 April 2005, Pages 15-20
نویسندگان
C.Y. Hu, S.L. Lo, C.M. Li, W.H. Kuan,