کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
9703557 1463553 2005 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Moisture diffusion into aluminum powder-filled epoxy adhesive in sodium chloride solutions
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی مکانیک
پیش نمایش صفحه اول مقاله
Moisture diffusion into aluminum powder-filled epoxy adhesive in sodium chloride solutions
چکیده انگلیسی
The objective of this study was to shed light on the influence of metal fillers on water/moisture sorption characteristics of adhesives. For that purpose, epoxy adhesive was filled by aluminum powder at four different contents (0, 10, 25 and 50 wt%). Water and fluid immersion tests were utilized to determine the moisture sorption behavior of aluminum powder-filled epoxy adhesive under complete immersion in distilled water and NaCl solutions. It was observed that the adhesives adsorb a larger amount of water upon exposure to distilled water than when exposed to different sodium chloride solutions. The moisture diffusion rate in the adhesive immersed in a test solution is, however, proportional to the salt concentration of the solution. It was also determined that there is no significant effect of aluminum filler content on moisture diffusivity in epoxy adhesive specimens while the addition of aluminum filler into epoxy decreases the total amount of water intake at saturation.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Adhesion and Adhesives - Volume 25, Issue 4, August 2005, Pages 337-341
نویسندگان
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