کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
977361 1480126 2016 15 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Fermionic qq-deformation and its connection to thermal effective mass of a quasiparticle
موضوعات مرتبط
مهندسی و علوم پایه ریاضیات فیزیک ریاضی
پیش نمایش صفحه اول مقاله
Fermionic qq-deformation and its connection to thermal effective mass of a quasiparticle
چکیده انگلیسی


• The low-temperature behavior of a qq-fermion gas model is studied.
• Some electronic properties of a qq-fermion gas are investigated.
• Some new properties concerning the fermionic q-calculus are proposed.
• The model parameter qq is connected with the thermal effective mass of a quasiparticle.

A fermionic deformation scheme is applied to a study on the low-temperature quantum statistical behavior of a quasifermion gas model with intermediate statistics. Such a model does not satisfy the Pauli exclusion principle, and its quantum statistical properties are based on a formalism of the fermionic qq-calculus. For low temperatures, several thermostatistical functions of the model such as the chemical potential, the heat capacity, and the entropy are derived by means of a function of the model deformation parameter qq. The effect of fermionic qq-deformation on the low-temperature thermostatistical properties of the model are discussed in detail. Our results show that the present deformed (quasi)fermion model provides remarkable connections of the model deformation parameter qq, first, with the thermal effective mass of a quasiparticle, and second, with the temperature parameter. Hence, it turns out that the model deformation parameter qq has also a role controlling the strength of effective quasiparticle interactions in the model. Finally, we conclude that this work can be useful for understanding the details of interaction mechanism of fermions such as quasiparticle states emergent in the fractional quantum Hall effect.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Physica A: Statistical Mechanics and its Applications - Volume 447, 1 April 2016, Pages 232–246
نویسندگان
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