کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
9783898 1512026 2005 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Trends, demands and challenges in TCAD
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد مواد الکترونیکی، نوری و مغناطیسی
پیش نمایش صفحه اول مقاله
Trends, demands and challenges in TCAD
چکیده انگلیسی
Currently, TCAD is most heavily used in the device research and process integration phases of a technology life cycle. However, a major trend visible in the industry is the demand to apply TCAD tools far beyond the integration phase into manufacturing and yield optimization. Short IC product lifetimes make fast yield ramp-up critical for being profitable and TCAD tools build a bridge between IC design and manufacturing. Another major trend is to use TCAD to evaluate layout dependent stress variations and account for these variations in the design flow of standard cells, libraries and custom ICs. This article gives an overview of those trends and addresses resulting challenges for TCAD models and tools.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: B - Volumes 124–125, 5 December 2005, Pages 81-85
نویسندگان
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