کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9786173 | 1512667 | 2005 | 18 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electrical package impact on VCSEL-based optical interconnects
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
مواد الکترونیکی، نوری و مغناطیسی
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
A new CAD tool fREEDA® based on state variable approach and universal error concept is presented for modelling and simulating systems where physical domains such as electrical, thermal, and optical interact with each other. A single implementation of device equations in fREEDA® can be used with different analysis types such as transient and harmonic balance, etc. To demonstrate the multi-physics capabilities of fREEDA®, we present a study of the impact of electrical packages on the source module performance in multi-gigabit per second vertical cavity surface emitting laser (VCSEL)-based optical interconnects. The effect of various operating conditions such as bias/drive level and driver configuration are studied. We consider electrical packages such as printed wire board, thin-film and flip-chip in our study. A comparison of VCSELs with stripe lasers is also presented.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Optics Communications - Volume 245, Issues 1â6, 17 January 2005, Pages 315-332
Journal: Optics Communications - Volume 245, Issues 1â6, 17 January 2005, Pages 315-332
نویسندگان
Ravi Pant, Mark A. Neifeld, Michael B. Steer, Houssam Kanj, Andreas Cangellaris,