کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9845684 | 1526518 | 2005 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A chip removal facility for indium bump bonded pixel detectors
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موضوعات مرتبط
مهندسی و علوم پایه
فیزیک و نجوم
ابزار دقیق
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Yield maximization in multichip hybrid pixel sensors is a crucial issue in large volume productions planned for future High-Energy Physics experiments. Bump bonding process optimization can guarantee statistical single bump failure rates at the acceptable level of 10-100Â ppm; nevertheless, systematic effects connected to process repeatability can affect the functionality of a full chip in a module to a much larger extent. Because of this, the reversibility of the bonding procedure has been investigated. A feasibility study on single chip assemblies for the ATLAS experiment has been successfully completed, proving the possibility of reworking. As a result of it, a dedicated facility has been conceptually designed, engineered and commissioned. The characteristics of the facility in terms of motion, temperature and tensile strength control are outlined, together with the main results.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment - Volume 540, Issues 2â3, 21 March 2005, Pages 259-265
Journal: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment - Volume 540, Issues 2â3, 21 March 2005, Pages 259-265
نویسندگان
A. Airoldi, G. Alimonti, M. Amati, A. Andreazza, A. Bulgheroni, M. Caccia, D. Giugni, W. Kucewicz, T. Lari, C. Meroni, F. Ragusa, C. Troncon, G. Vegni,