Thermal analysis of a nano-pore silicon-based substrate using a YAG phosphor supported COB packaged LED module
Keywords: Cerium-activated yttrium aluminium garnet (YAG:Ce3+); Chip-on-board (COB); Light-emitting diode (LED); Nano-pore silicon-based (NPSB) substrate; Anodised aluminium oxide (AAO); Plasma-enhanced chemical vapour deposition (PECVD);