کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
10142101 1646091 2019 29 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Selenization of electrochemically synthesized copper-indium layers from non-aqueous solution for solar cell application
ترجمه فارسی عنوان
جداسازی لایه های مس-اسیدهای سنتز شده الکتروشیمیایی از محلول غیر آبی برای کاربرد سلول های خورشیدی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
چکیده انگلیسی
A simple two-step, electrodeposition of copper-indium (Cu-In) intermetallic alloy thin films followed by selenization process was employed for the synthesis and development of CuInSe2 (CIS) thin film solar cells (TFSC). The co-deposition of Cu and In in ethylene glycol at 130 °C was studied using the cyclic voltammetry (CV) to obtain a stable Cu-In phase. A wide window of deposition potentials from −0.7 V to −1.5 V versus Ag/AgCl reference electrode was optimized. Three different potentials, −0.7 V, −1.0 V and −1.3 V are chosen to deposit the Cu-In intermetallic alloy thin films, which were further selenized in controlled selenium ambient at 400 °C. The selenization effect is studied extensively on structural, morphological, optical and compositional properties of selenized Cu-In (CIS) thin films. Polycrystalline CIS layers with tetragonal crystal structure are obtained upon selenization of Cu-In thin films. Three prominent reflections of CIS, (112), (204/220) and (312/116) are exhibited in all selenized Cu-In layers. Additional secondary phases of CuxSe1-x are attributed for the layers grown at −0.7 and −1.0 V. Compact and void-free surface morphology with particle size ∼1-2 μm was observed for all selenized samples. The selenized Cu-In layer sample deposited at −1.3 V measure ∼1.06 eV energy band gap with polycrystalline tetragonal chalcopyrite crystal structure of CIS. The photoelectrochemical measurement confirms the growth of p-type material. A selenized Cu-In layer deposited at −1.3 V with CdS window layer measured power conversion efficiency 5.44%.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 771, 15 January 2019, Pages 246-253
نویسندگان
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