کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10156024 | 1666369 | 2019 | 15 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
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چکیده انگلیسی
In this paper, new type Cu nanoaggregates (Cu NAs) were designed, and the Cu-Cu bonding by Cu NAs was investigated. The Cu NAs were obtained by agglomeration of the synthesized 5â¯nm Cu nanoparticles (Cu NPs). Compared to ultra-small Cu NPs, the collection difficulties were effectively solved and the antioxidation properties were also enhanced by the formation of Cu NAs. After sintering at 250â¯Â°C for 60â¯min, the Cu NAs film achieved a low electrical resistivity of 4.1â¯Î¼Î©â¯cm, which is only 2.5 times larger than that of bulk Cu. A high strength Cu-Cu bonding joint of 25.36â¯MPa can also be achieved via sintering of Cu NAs at 250â¯Â°C under a low bonding pressure of 1.08â¯MPa. After characterizations of Cu-Cu bonding interfaces and fracture structures of bonded joints, the Cu-Cu interconnection was demonstrated to be tightly contacted, sufficiently diffused and with high purity. In addition, a sintering and bonding mechanism by Cu NAs were proposed, explaining the key role played by ultra-small Cu NPs on the shell layer of Cu NAs. According to the advantages, Cu NAs are expected to be ideal substitutes to traditional solders, which have a huge application prospect in electronics packaging.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 772, 25 January 2019, Pages 793-800
Journal: Journal of Alloys and Compounds - Volume 772, 25 January 2019, Pages 793-800
نویسندگان
Junjie Li, Qi Liang, Tielin Shi, Ji Fan, Bo Gong, Chen Feng, Jinhu Fan, Guanglan Liao, Zirong Tang,