کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10392255 | 885070 | 2005 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Experimental study of transient natural convection heat transfer from simulated electronic chips
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
Experiments are performed using water to study the single-phase transient natural convection heat transfer from in-line four simulated electronic chips, which are flush-mounted to one wall of a vertical rectangular channel. The heat flux ranges from 1Â kW/m2 to 6Â kW/m2. The effect of heat fluxes, geometric parameters such as chip configuration numbers are investigated. The results indicate that the heat transfer coefficient is affected strongly by the number of chips. Results compare favourably with those obtained from the literature for steady-state forced and natural convection heat transfer. Correlations are presented for individual chips as well as for overall data in the transient regime. The transient correlation for overall data recommended is Nuâ=1.06(Fo)-0.47(Raâ)1/4.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Experimental Thermal and Fluid Science - Volume 29, Issue 4, April 2005, Pages 485-492
Journal: Experimental Thermal and Fluid Science - Volume 29, Issue 4, April 2005, Pages 485-492
نویسندگان
H. Bhowmik, K.W. Tou,