Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens

Tin-based solder joints are often near single or multi-crystalline and not polycrystalline, determined by comparing orientations measured using OIM on opposite sides of two solder joints. Comparison with 17 other joints indicated no preferred solidification orientation, though the likelihood for the tin c-axis to be in the plane of the joint is low.