Wetting, adhesion and diffusion in Cu-Al/SiO2 system at 1473Â K

Sessile-drop wetting experiments and interfacial microstructure examinations show that at high temperature, Cu alloyed with Al mildly promotes the wettability, yet fails to enhance the adhesion and impede the thermal diffusion between Cu and SiO2, in contrast to the behavior observed in low-temperature annealing studies.