Effect of alloying elements on the creep behavior of high Pb-based solders

▶ This study examines creep behavior of four high Pb-based solders with alloying elements. ▶ Dislocation creep limited by dislocation climb or viscous solute drag occurs in high Pb solders. ▶ Viscous solute drag is the rate-limiting step for creep of 90Pb-10Sn due to high concentration of Sn. ▶ The climb mechanism is switched from pipe diffusion to lattice diffusion at ∼0.7Tm. ▶ Activation energy for dislocation creep is reduced by In and Sn substitutional elements.