کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10656528 | 1005558 | 2014 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Mechanical property of the epoxy-contained Sn-58Bi solder with OSP surface finish
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
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چکیده انگلیسی
In the electronic packaging technology, lead-free solders have been widely used to replace lead-based solders because of the toxicity of lead. Among the investigated lead-free solders, the Sn-58Bi solder has been considered as a highly promising candidate because of its low-melting temperature, high tensile strength and good creep resistance. However, the Sn-58Bi solder has poor ductility and shock absorbance. To enhance the mechanical properties of the Sn-58Bi solder, epoxy resin is mixed with the Sn-58Bi solder. The advantages of the Sn-58Bi solder with epoxy are good reliability and no need of a cleaning process. This study elucidated not only the mechanical properties of the Sn-58Bi epoxy solder but also the effects of the epoxy during the reflow process by conducting a shear test and a board-level drop test. The shear strength of the Sn-58Bi epoxy solder was about 2 times higher than that of the Sn-58Bi solder. In result of the drop test, the Sn-58Bi solder specimen failed under the 10th drop. However, the number of drops of the Sn-58Bi epoxy solder was over 100 drops without failure.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 615, Supplement 1, 5 December 2014, Pages S411-S417
Journal: Journal of Alloys and Compounds - Volume 615, Supplement 1, 5 December 2014, Pages S411-S417
نویسندگان
Woo-Ram Myung, Yongil Kim, Seung-Boo Jung,