کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
10668692 | 1008385 | 2010 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Evaluation of stress during and after sputter deposition of Cu and Ta films
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The stress evolution of magnetron sputtered copper and tantalum films is presented for samples prepared at various sputtering pressures and powers. In-situ stress values were calculated using measurements from a Multi-beam Optical Stress Sensor (MOSS) system, while ex-situ stress values were calculated using measurements from a stylus profilometer. Extensive microstructural and surface analysis were performed by several techniques and related to the stress state of the film. The results demonstrate that during deposition, independent of the adatom mobility, the stress curves are initially compressive at low sputtering pressures, while at the highest sputtering pressure (1.4Â Pa) the stress trend is always tensile. Meanwhile, the stress curves after deposition show a tensile trend for both materials at all sputtering pressures.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 205, Issue 7, 25 December 2010, Pages 2355-2361
Journal: Surface and Coatings Technology - Volume 205, Issue 7, 25 December 2010, Pages 2355-2361
نویسندگان
A.A. Navid, E. Chason, A.M. Hodge,